1. Multi-stage in-line operation with concurrent fluxing, preheating and soldering for increased throughput with maximum preheat capability
2. 2segment configuration can solder two non-panelized boards in-line, each board up to 350 x 508 mm
3. Parallel processing mode can solder boards up to 508 x 508mm with dual solder nozzles
4. Double processing mode with small and large nozzles can solder boards up to 700 x 508 mm
5. Full titanium solder pots compatible with all solder alloys plus easy tool-free maintenance